Invention Publication
- Patent Title: HOT-ROLLED COPPER ALLOY SHEET AND SPUTTERING TARGET
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Application No.: US18547597Application Date: 2022-02-08
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Publication No.: US20240183009A1Publication Date: 2024-06-06
- Inventor: Yosuke NAKASATO , Kazunari MAKI , Yasuhiro TSUGAWA , U TANI
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP 21032440 2021.03.02
- International Application: PCT/JP2022/004909 2022.02.08
- Date entered country: 2023-08-23
- Main IPC: C22C9/01
- IPC: C22C9/01 ; C23C14/34

Abstract:
This hot-rolled copper alloy sheet contains Mg: 0.2 mass % or more and 2.1 mass % or less, and Al: 0.4 mass % or more and 5.7 mass % or less, with a remainder being Cu and inevitable impurities, among the inevitable impurities, an amount of Fe is 0.0020 mass % or less, an amount of O is 0.0020 mass % or less, an amount of S is 0.0030 mass % or less, and an amount of P is 0.0010 mass % or less, a special grain boundary length ratio (Lσ/L) which is a ratio of a sum Lσ of lengths of grain boundaries with 3≤Σ≤29 to a length L of all measured crystal grain boundaries by an EBSD method is 20% or more, and an average crystal grain size μA in a sheet-thickness central portion is 40 μm or less.
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