Invention Publication
- Patent Title: WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
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Application No.: US18285989Application Date: 2022-04-04
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Publication No.: US20240188227A1Publication Date: 2024-06-06
- Inventor: Keita IIMURA , Shuji KAWAGUCHI , Kazuki KINOSHITA , Hidetoshi IIOKA , Seiji TAKE
- Applicant: DAI NIPPON PRINTING CO., LTD.
- Applicant Address: JP Tokyo-to
- Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee: DAI NIPPON PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo-to
- Priority: JP 21066761 2021.04.09
- International Application: PCT/JP2022/017051 2022.04.04
- Date entered country: 2023-10-06
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/02

Abstract:
A wiring board includes: a substrate having transparency; a mesh wiring portion arranged on the substrate and including a plurality of wiring lines; and a dummy wiring portion arranged around the mesh wiring portion and including a plurality of dummy wiring lines electrically independent of the wiring lines. The mesh wiring portion is comprised of an iterative array of a predetermined unit pattern in a first direction. In the first direction, a gap between the mesh wiring portion and the dummy wiring portion is 0.01 times or more and 0.2 times or less a pitch of the unit pattern in the first direction.
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