公开(公告)号：US20240235004A1

公开(公告)日：2024-07-11

申请号：US18282394

申请日：2022-03-16

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kazuki KINOSHITA ,  Shotaro HOSODA ,  Hidetoshi IIOKA ,  Keita IIMURA ,  Shuji KAWAGUCHI ,  Masashi SAKAKI ,  Seiji TAKE

IPC: H01Q1/22 ,  H01Q1/38 ,  H05K1/02 ,  H05K3/06 ,  H05K3/38 ,  H10K59/95

CPC classification number: H01Q1/22 ,  H01Q1/38 ,  H05K1/0274 ,  H05K3/386 ,  H10K59/95 ,  H05K3/067 ,  H05K2201/09245 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: A wiring board includes a substrate that has transparency, a primer layer provided on the substrate, and a mesh wiring layer that is disposed on the primer layer and that includes a plurality of first-direction wiring lines and a plurality of second-direction wiring lines that interconnect the plurality of first-direction wiring lines. The primer layer includes a polymer material. At intersections of the first-direction wiring lines and the second-direction wiring lines, at least one corner portion of four corner portions formed between the first-direction wiring lines and the second-direction wiring lines is rounded in plan view.

公开(公告)号：US20240188227A1

公开(公告)日：2024-06-06

申请号：US18285989

申请日：2022-04-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita IIMURA ,  Shuji KAWAGUCHI ,  Kazuki KINOSHITA ,  Hidetoshi IIOKA ,  Seiji TAKE

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4602 ,  H05K1/0298 ,  H05K3/4652 ,  H05K2201/09781

Abstract: A wiring board includes: a substrate having transparency; a mesh wiring portion arranged on the substrate and including a plurality of wiring lines; and a dummy wiring portion arranged around the mesh wiring portion and including a plurality of dummy wiring lines electrically independent of the wiring lines. The mesh wiring portion is comprised of an iterative array of a predetermined unit pattern in a first direction. In the first direction, a gap between the mesh wiring portion and the dummy wiring portion is 0.01 times or more and 0.2 times or less a pitch of the unit pattern in the first direction.

公开(公告)号：US20240121999A1

公开(公告)日：2024-04-11

申请号：US18285902

申请日：2022-04-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita IIMURA ,  Shuji KAWAGUCHI ,  Kazuki KINOSHITA ,  Hidetoshi IIOKA ,  Seiji TAKE

IPC: H10K59/127 ,  H10K59/131

CPC classification number: H10K59/1275 ,  H10K59/131

Abstract: A multilayer body for an image display device includes a wiring substrate including a substrate having transparency, and a mesh wiring layer disposed on the substrate; and a dielectric layer stacked on the wiring substrate. The dielectric layer and the substrate have a total thickness of 50 μm or more and 500 μm or less.