公开(公告)号：US20240258690A1

公开(公告)日：2024-08-01

申请号：US18624600

申请日：2024-04-02

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita IIMURA ,  Kazuki KINOSHITA ,  Masashi SAKAKI ,  Seiji TAKE ,  Shuji KAWAGUCHI

IPC: H01Q1/38 ,  H01Q1/22 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H05K1/0296 ,  H05K1/18 ,  H05K2201/09781 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: A wiring board includes a substrate and a mesh wiring layer and has an electromagnetic wave transceiver function. The substrate is transparent. The mesh wiring layer serves as an antenna and includes a wiring line. Two or more opening portions are formed by being surrounded by the wiring line. A planar shape of each opening portion is polygonal that has opposing sides parallel with each other. 95% or more opening portions among 100 opening portions or all of the opening portions satisfy a relationship of 0.70D≤d≤0.98D or satisfy a relationship of 1.02D≤d≤1.30D, where d is distances between sides that extend in a first direction regarding the opening portions, and D is an average value of the distances between the sides that extend in the first direction regarding the 100 opening portions continuously adjacent to each other or all of the opening portions.

公开(公告)号：US20250013089A1

公开(公告)日：2025-01-09

申请号：US18697777

申请日：2022-10-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Masashi SAKAKI ,  Kazuki KINOSHITA ,  Keita IIMURA ,  Seiji TAKE ,  Shuji KAWAGUCHI

IPC: G02F1/1333 ,  H01Q1/22 ,  H05K1/18 ,  H10K59/131

Abstract: An image display device laminate includes a wiring board that has a substrate and a mesh wiring layer disposed on a first face of the substrate, a first adhesive layer situated on the first face side of the substrate, a second adhesive layer situated on the second face side of the substrate, and an intermediate layer situated in at least one of a position between the wiring board and the first adhesive layer and a position between the wiring board and the second adhesive layer. The substrate has transparency. A partial region of the substrate is disposed in a partial region between the first adhesive layer and the second adhesive layer.

公开(公告)号：US20250016927A1

公开(公告)日：2025-01-09

申请号：US18708255

申请日：2022-11-08

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroki FURUSHOU ,  Seiji TAKE ,  Kazuki KINOSHITA ,  Masashi SAKAKI

IPC: H05K1/18 ,  G02F1/1345 ,  H01Q1/22 ,  H10K59/131

Abstract: A module includes a wiring board that has a substrate and a mesh wiring layer and a power supply unit and a protective layer, and a power supply line that is electrically connected to the power supply unit via an anisotropic conductive film containing conductive particles. The substrate has transparency. The protective layer covers only part of the power supply unit. The anisotropic conductive film covers a region of the power supply unit that is not covered by the protective layer.

公开(公告)号：US20240235004A1

公开(公告)日：2024-07-11

申请号：US18282394

申请日：2022-03-16

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kazuki KINOSHITA ,  Shotaro HOSODA ,  Hidetoshi IIOKA ,  Keita IIMURA ,  Shuji KAWAGUCHI ,  Masashi SAKAKI ,  Seiji TAKE

IPC: H01Q1/22 ,  H01Q1/38 ,  H05K1/02 ,  H05K3/06 ,  H05K3/38 ,  H10K59/95

CPC classification number: H01Q1/22 ,  H01Q1/38 ,  H05K1/0274 ,  H05K3/386 ,  H10K59/95 ,  H05K3/067 ,  H05K2201/09245 ,  H05K2201/10098 ,  H05K2201/10128

Abstract: A wiring board includes a substrate that has transparency, a primer layer provided on the substrate, and a mesh wiring layer that is disposed on the primer layer and that includes a plurality of first-direction wiring lines and a plurality of second-direction wiring lines that interconnect the plurality of first-direction wiring lines. The primer layer includes a polymer material. At intersections of the first-direction wiring lines and the second-direction wiring lines, at least one corner portion of four corner portions formed between the first-direction wiring lines and the second-direction wiring lines is rounded in plan view.

公开(公告)号：US20240188227A1

公开(公告)日：2024-06-06

申请号：US18285989

申请日：2022-04-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita IIMURA ,  Shuji KAWAGUCHI ,  Kazuki KINOSHITA ,  Hidetoshi IIOKA ,  Seiji TAKE

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4602 ,  H05K1/0298 ,  H05K3/4652 ,  H05K2201/09781

Abstract: A wiring board includes: a substrate having transparency; a mesh wiring portion arranged on the substrate and including a plurality of wiring lines; and a dummy wiring portion arranged around the mesh wiring portion and including a plurality of dummy wiring lines electrically independent of the wiring lines. The mesh wiring portion is comprised of an iterative array of a predetermined unit pattern in a first direction. In the first direction, a gap between the mesh wiring portion and the dummy wiring portion is 0.01 times or more and 0.2 times or less a pitch of the unit pattern in the first direction.

公开(公告)号：US20240121999A1

公开(公告)日：2024-04-11

申请号：US18285902

申请日：2022-04-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Keita IIMURA ,  Shuji KAWAGUCHI ,  Kazuki KINOSHITA ,  Hidetoshi IIOKA ,  Seiji TAKE

IPC: H10K59/127 ,  H10K59/131

CPC classification number: H10K59/1275 ,  H10K59/131

Abstract: A multilayer body for an image display device includes a wiring substrate including a substrate having transparency, and a mesh wiring layer disposed on the substrate; and a dielectric layer stacked on the wiring substrate. The dielectric layer and the substrate have a total thickness of 50 μm or more and 500 μm or less.

公开(公告)号：US20230318203A1

公开(公告)日：2023-10-05

申请号：US18029970

申请日：2021-10-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kazuki KINOSHITA ,  Keita IIMURA ,  Seiji TAKE ,  Shuji KAWAGUCHI ,  Masashi SAKAKI

IPC: H01Q21/06 ,  H05K3/10 ,  H01Q1/22 ,  H01Q1/44

CPC classification number: H01Q21/061 ,  H05K3/108 ,  H01Q1/22 ,  H01Q1/44 ,  H05K2203/0723

Abstract: A wiring board includes a substrate, a wiring pattern area arranged on the substrate and including pieces of wiring, and a plurality of dummy pattern areas arranged around the wiring pattern area and electrically independent of the wiring. An aperture ratio of a first dummy pattern area, which is located next to the wiring pattern area, is not lower than an aperture ratio of the wiring pattern area. In addition, an aperture ratio of a second dummy pattern area, which is located next to the first dummy pattern area and farther from the wiring pattern area than the first dummy pattern area is, is higher than the aperture ratio of the first dummy pattern area.