Invention Publication
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND METHOD FOR DETERMINING DETERIORATION DEGREE OF CONDUCTIVE PIPE
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Application No.: US18582809Application Date: 2024-02-21
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Publication No.: US20240189852A1Publication Date: 2024-06-13
- Inventor: Tadashi IINO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP 20040244 2020.03.09
- Main IPC: B05B15/18
- IPC: B05B15/18 ; G01N27/07

Abstract:
A substrate processing apparatus includes: a substrate holder that holds and processes a substrate; a nozzle that ejects a processing liquid to the substrate held by the substrate holder; a conductive pipe connected to the nozzle and configured to supply the processing liquid to the nozzle; a processing liquid supply that supplies the processing liquid to the nozzle via the conductive pipe; a ground line that connects the conductive pipe and a reference potential; a liquid receiver provided around the substrate holder and configured to receive the processing liquid ejected from the nozzle; an electrode provided close to the liquid receiver; a voltage source configured to apply a voltage to the electrode and impart a potential difference between a liquid contact surface of the liquid receiver and the reference potential; and an ammeter configured to measure a current value of a current flowing through a charge moving path.
Public/Granted literature
- US12275030B2 Substrate processing apparatus and method for determining deterioration degree of conductive pipe Public/Granted day:2025-04-15
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