Invention Publication
- Patent Title: Preparation Method of Electroplated Part and Electroplated Part
-
Application No.: US18537279Application Date: 2023-12-12
-
Publication No.: US20240191384A1Publication Date: 2024-06-13
- Inventor: Daiqiong (Diana) Zhang , Jialin Zhang , Wenzheng Ma , Weidong Zhang , Zhongxi Huang
- Applicant: Tyco Electronics (Shanghai) Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co., Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Priority: CN 2211603878.5 2022.12.13
- Main IPC: C25D3/56
- IPC: C25D3/56 ; C25D5/12 ; C25D5/18 ; C25D5/48
Abstract:
A preparation method of an electroplated part includes the steps of plating a porous metal coating layer, placing the porous metal coating layer in a graphite colloid, and depositing graphite colloidal particles into the porous metal coating layer. The porous metal coating layer is plated at or proximate an outer side of a substrate of the electroplated part. The graphite colloidal particles are deposited into pores of the porous metal coating layer from the graphite colloid to form a graphite alloy coating layer.
Information query
