Invention Publication
- Patent Title: PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
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Application No.: US17907857Application Date: 2021-06-28
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Publication No.: US20240194450A1Publication Date: 2024-06-13
- Inventor: Yasushi Sonoda , Motohiro Tanaka , Yusuke Nakatani
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Hitachi High-Tech Corporation
- Current Assignee: Hitachi High-Tech Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- International Application: PCT/JP2021/024374 2021.06.28
- Date entered country: 2022-08-29
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/67

Abstract:
A plasma processing device and method which allow control of a density ratio between ions and radicals, including a processing chamber, a radio frequency power supply which supplies microwave radio frequency power for plasma generation, a magnetic field generating mechanism which generates a magnetic field in the processing chamber, a sample stand disposed in the processing chamber, and a shielding plate disposed above the sample stand for shielding incidence of an ions onto the sample stand. The magnetic field generating mechanism includes a coil disposed around an outer periphery of the processing chamber, and a power supply connected to the coil. The mechanism allows a power supply of the magnetic field generating mechanism or the radio frequency power supply to control a plasma generating position with respect to the shielding plate, and to generate plasma by periodically changing the plasma generating position vertically with respect to the shielding plate.
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