In a general aspect, a semiconductor device module includes a ceramic substrate having a first surface and a second surface opposite the first surface, a patterned metal layer disposed on the first surface of the ceramic substrate, a semiconductor die disposed on the patterned metal layer, and a cooling structure disposed on the second surface of the ceramic substrate. The cooling structure includes a plurality of copper sheets defining a plurality of fluidic-cooling channels. At least one copper sheet of the plurality of copper sheets is at least one of coated or plated with a corrosion-resistant material. The module also includes a molding compound that encapsulates the ceramic substrate, the patterned metal layer and the semiconductor die. The molding compound also partially encapsulates the cooling structure, such that a fluidic interface surface of the cooling structure is exposed through the molding compound.