Invention Publication
- Patent Title: Back Cover of Electronic Device, and Electronic Device
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Application No.: US17910104Application Date: 2022-04-18
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Publication No.: US20240198635A1Publication Date: 2024-06-20
- Inventor: Wenlong Huo , Bangshi Yin , Wenbo Wu , Chengjie Gao
- Applicant: Honor Device Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Honor Device Co., Ltd.
- Current Assignee: Honor Device Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Priority: CN 2110922162.0 2021.08.12
- International Application: PCT/CN2022/087448 2022.04.18
- Date entered country: 2022-09-08
- Main IPC: B32B15/14
- IPC: B32B15/14 ; B32B3/30 ; B32B5/02 ; B32B7/02 ; B32B7/12 ; B32B9/02 ; B32B9/04 ; H04M1/02

Abstract:
A back cover of an electronic device and an electronic device are provided. The back cover of the electronic device includes: a first structure layer including a first region and a second region, where a thickness of the first region is greater than a thickness of the second region, the second region forms a second region orthographic projection along a thickness direction of the electronic device, a battery of the electronic device forms a battery orthographic projection along the thickness direction of the electronic device, and the second region orthographic projection includes the battery orthographic projection. The back cover can be adapted to a middle frame of an electronic device with a glass back cover.
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