公开(公告)号：US20240422251A1

公开(公告)日：2024-12-19

申请号：US18705298

申请日：2023-05-05

Applicant: HONOR DEVICE CO., LTD.

Inventor： Chengjie Gao ,  Xuyang Wang ,  Wenbo Wu

IPC: H04M1/02 ,  B28B11/00 ,  B28B11/24 ,  B28B23/00 ,  C04B35/653 ,  C04B41/00 ,  C04B41/45

Abstract: This application provides a 5D ceramic housing structure and a 5D ceramic processing process method, to resolve a problem that long processing time of existing CNC and polishing results in high production costs of a housing of an electronic device and low production efficiency. The method includes: obtaining a raw ceramic material, that is, a ceramic powder; performing casting processing on the raw ceramic material to obtain a to-be-sintered green-state ceramic sheet; performing flat ceramic sheet pre-sintering on the green-state ceramic sheet to obtain a sintered product with a shrinkage rate of 18% to 23%; performing 5D heat-bend forming on the sintered product, to enable the sintered product to be further crystallized and deformed by heating to form a ceramic housing; performing fiber adhesion on the ceramic housing; and forming a 5D ceramic housing structure.

公开(公告)号：US20240198635A1

公开(公告)日：2024-06-20

申请号：US17910104

申请日：2022-04-18

Applicant: Honor Device Co., Ltd.

Inventor： Wenlong Huo ,  Bangshi Yin ,  Wenbo Wu ,  Chengjie Gao

IPC: B32B15/14 ,  B32B3/30 ,  B32B5/02 ,  B32B7/02 ,  B32B7/12 ,  B32B9/02 ,  B32B9/04 ,  H04M1/02

CPC classification number: B32B15/14 ,  B32B3/30 ,  B32B5/02 ,  B32B7/02 ,  B32B7/12 ,  B32B9/025 ,  B32B9/041 ,  H04M1/0266 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/7376 ,  B32B2457/00

Abstract: A back cover of an electronic device and an electronic device are provided. The back cover of the electronic device includes: a first structure layer including a first region and a second region, where a thickness of the first region is greater than a thickness of the second region, the second region forms a second region orthographic projection along a thickness direction of the electronic device, a battery of the electronic device forms a battery orthographic projection along the thickness direction of the electronic device, and the second region orthographic projection includes the battery orthographic projection. The back cover can be adapted to a middle frame of an electronic device with a glass back cover.