Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US18082473Application Date: 2022-12-15
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Publication No.: US20240203896A1Publication Date: 2024-06-20
- Inventor: Zheng Wei WU , Cheng Kai CHANG
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31
Abstract:
The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.
Information query
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