公开(公告)号：US20240203897A1

公开(公告)日：2024-06-20

申请号：US18082478

申请日：2022-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Zheng Wei WU ,  Cheng Kai CHANG

IPC: H01L23/552 ,  H01L21/50 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/3121

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate. A method for manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20250096213A1

公开(公告)日：2025-03-20

申请号：US18369108

申请日：2023-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Pai-Sheng SHIH ,  Kuan-Fu CHEN ,  Cheng Kai CHANG

IPC: H01L25/16

Abstract: An optical package structure is provided. The optical package structure includes a carrier, an optical emitter, an optical receiver, an optical barrier, and an insulating structure. The optical emitter and the optical receiver are over the carrier. The optical barrier is over the carrier and between the optical emitter and the optical receiver, wherein the optical barrier defines a cavity. The insulating structure is filled in the cavity, wherein an elevation of a top surface of the insulating structure is lower than an elevation of a top surface of the optical barrier with respect to a surface of the carrier.

公开(公告)号：US20240203896A1

公开(公告)日：2024-06-20

申请号：US18082473

申请日：2022-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Zheng Wei WU ,  Cheng Kai CHANG

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3157 ,  H01L23/5384

Abstract: The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.