公开(公告)号：US20240203897A1

公开(公告)日：2024-06-20

申请号：US18082478

申请日：2022-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Zheng Wei WU ,  Cheng Kai CHANG

IPC: H01L23/552 ,  H01L21/50 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/3121

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate. A method for manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20240203896A1

公开(公告)日：2024-06-20

申请号：US18082473

申请日：2022-12-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Zheng Wei WU ,  Cheng Kai CHANG

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3157 ,  H01L23/5384

Abstract: The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.

公开(公告)号：US20230335505A1

公开(公告)日：2023-10-19

申请号：US18212162

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Zheng Wei WU

IPC: H01L23/552 ,  H01L21/768 ,  H01L21/78 ,  H01L21/50 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/768 ,  H01L21/78 ,  H01L21/50 ,  H01L24/14 ,  H01L2924/3025

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

公开(公告)号：US20220399283A1

公开(公告)日：2022-12-15

申请号：US17346068

申请日：2021-06-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Zheng Wei WU

IPC: H01L23/552 ,  H01L21/768 ,  H01L23/00 ,  H01L21/78 ,  H01L21/50

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.