A film package includes: a film substrate having a first side surface and a second side surface opposing each other in a first direction, each of the first side surface and the second side surface extending in a second direction perpendicular to the first direction; at least one semiconductor chip disposed on the film substrate and extending lengthwise in the first direction; input terminals arranged on the film substrate along the first side surface, output terminals arranged on the film substrate along the second side surface, and wirings formed on the film substrate and electrically connecting the input terminals and the output terminals to the at least one semiconductor chip; and a protective layer covering the wirings on the film substrate.