The present disclosure relates to an electronic device comprising a heat dissipation structure. The electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.