公开(公告)号：US20240365486A1

公开(公告)日：2024-10-31

申请号：US18648061

申请日：2024-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yeonwoo KIM ,  Yongbeen YUN ,  Taekkyun CHOI ,  Hyunsoo KIM ,  Chonghwa SEO

IPC: H05K5/02

CPC classification number: H05K5/0217 ,  H05K5/0247

Abstract: An electronic device includes a display including a panel conductive layer, a mechanical support part facing the display, and a conductive member disposed between the panel conductive layer and the mechanical support part where the conductive member includes an elastic member at least partially accommodated in the mechanical support part and a conductive plate electrically connected with the panel conductive layer, the conductive plate including a base region surrounding at least a portion of the elastic member and a wing region, the elastic member includes a front surface facing in a first direction toward the panel conductive layer and disposed in a higher position than the wing region, a side surface facing in a second direction perpendicular to the first direction, and a rear surface facing in a direction opposite to the first direction and disposed in a lower position than the wing region extending in the second direction.

公开(公告)号：US20230262940A1

公开(公告)日：2023-08-17

申请号：US18303284

申请日：2023-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taewook HAM ,  Moonhyung KWON ,  Min PARK ,  Younggirl YUN ,  Taekkyun CHOI

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20481 ,  G06F1/203

Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

公开(公告)号：US20200313715A1

公开(公告)日：2020-10-01

申请号：US16321413

申请日：2017-07-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Hyangbok LEE ,  Byoung-Ryoul SONG ,  Taelee LEE ,  Soonheung KWON ,  Min-Seok KIM ,  Won-Seob KIM ,  Yoon-Goo NAM ,  Sung-Soo KIM ,  Sigwan KIM ,  Seung-Hwa SHIN ,  Taekkyun CHOI ,  Young HEO

IPC: H04B1/401 ,  H04B7/0404

Abstract: Various examples of the present invention relate to a device and a method for improving wireless communication performance in an electronic device. The electronic device comprises multiple antennas, a communication circuit connected to the multiple antennas, a connector, and at least one processor, wherein the processor checks whether a wired cable is connected through the connector and, if the wired cable is connected through the connector, can perform control such that communication using the multiple antennas corresponding to the connection of the wired cable is performed. Other examples can be possible.

公开(公告)号：US20240206120A1

公开(公告)日：2024-06-20

申请号：US18594595

申请日：2024-03-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook HAM ,  Moonhyung KWON ,  Younggirl YUN ,  Taekkyun CHOI ,  Wonhyung HEO

IPC: H05K7/20

CPC classification number: H05K7/20336

Abstract: The present disclosure relates to an electronic device comprising a heat dissipation structure. The electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.