HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

    公开(公告)号:US20230262940A1

    公开(公告)日:2023-08-17

    申请号:US18303284

    申请日:2023-04-19

    CPC classification number: H05K7/20481 G06F1/203

    Abstract: An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.

    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION STRUCTURE

    公开(公告)号:US20240206120A1

    公开(公告)日:2024-06-20

    申请号:US18594595

    申请日:2024-03-04

    CPC classification number: H05K7/20336

    Abstract: The present disclosure relates to an electronic device comprising a heat dissipation structure. The electronic device may comprise: a bracket comprising a first area, a second area partitioned from the first area, and a heat dissipation area extendedly formed from a portion of the first area up to a portion of the second area; a circuit board comprising a heating source and disposed in the first area; a battery disposed in the second area; a vapor chamber disposed in the heat dissipation area and, in order to provide a transfer path for heat generated from the heating source, comprises a first part disposed so as to face the heating source, and a second part disposed so as to face the battery; and a filling member coated between the second area and the battery in order to transfer the heat dissipated from the vapor chamber to the battery, wherein the vapor chamber has a buffer area formed at an edge area thereof in order to receive the filling member.

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