发明公开
- 专利标题: HEAT EXCHANGER
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申请号: US18396560申请日: 2023-12-26
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公开(公告)号: US20240210123A1公开(公告)日: 2024-06-27
- 发明人: Seungmo JUNG , Hongseong KIM , Sungwoo KIM , Hanchoon LEE
- 申请人: LG ELECTRONICS INC.
- 申请人地址: KR Seoul
- 专利权人: LG ELECTRONICS INC.
- 当前专利权人: LG ELECTRONICS INC.
- 当前专利权人地址: KR Seoul
- 优先权: KR 20220186120 2022.12.27
- 主分类号: F28F1/32
- IPC分类号: F28F1/32 ; F28F9/02
摘要:
A heat exchanger of the present disclosure includes a plurality of fin tubes; in which refrigerant channels through which refrigerant flows are formed and which are arranged to be spaced apart in one direction; and a pair of headers configured to communicate with the refrigerant channels of the fin tubes, wherein each of the fin tubes of the plurality of fin tubes includes refrigerant channels through which a refrigerant can flow, a header hole through which the refrigerant can flows, and a header collar protruding in one direction from an edge of the header hole, wherein the one header collar of a respective fin tube of the plurality of fin tubes is inserted into another the header hole of the adjacent fin tube to the one respective fin tube, and wherein the pair of headers are configured to communicate with the refrigerant channels of the fin tubes.
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