Invention Publication
- Patent Title: ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
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Application No.: US18557020Application Date: 2022-01-26
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Publication No.: US20240215155A1Publication Date: 2024-06-27
- Inventor: Makoto TSUNEKAWA
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Priority: JP 21074403 2021.04.26
- International Application: PCT/JP2022/002939 2022.01.26
- Date entered country: 2023-10-24
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/05 ; H05K3/00 ; H05K3/10
Abstract:
An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.
Information query
