公开(公告)号：US20240237200A1

公开(公告)日：2024-07-11

申请号：US18557010

申请日：2022-01-26

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto TSUNEKAWA

IPC: H05K1/02 ,  H05K3/24

CPC classification number: H05K1/0296 ,  H05K3/245 ,  H05K2201/2018 ,  H05K2203/0228

Abstract: An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.

公开(公告)号：US20240373564A1

公开(公告)日：2024-11-07

申请号：US18557015

申请日：2022-01-26

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto TSUNEKAWA

IPC: H05K5/00 ,  H05K1/11

Abstract: An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The frame has a through hole. The reinforcement portion is disposed on the edge of the through hole. The reinforcement portion reinforces the edge of the through hole.

公开(公告)号：US20240224435A1

公开(公告)日：2024-07-04

申请号：US18550252

申请日：2022-01-25

Applicant: NITTO DENKO CORPORATION

Inventor： Hayato TAKAKURA ,  Naoki SHIBATA ,  Makoto TSUNEKAWA

IPC: H05K3/46

CPC classification number: H05K3/4644

Abstract: A method for producing a wiring circuit board includes a step of forming an insulating layer on one surface in a thickness direction of a substrate, a step of forming a plurality of wirings on one surface in the thickness direction of the insulating layer, a step of forming an opening portion including the plurality of wirings when projected in the thickness direction in the substrate, a step of forming a resist pattern having an opening portion having a pattern shape along the plurality of wirings on the other surface in the thickness direction of the insulating layer, a step of forming a metal support portion by depositing a metal material on the insulating layer inside the opening portion, and a step of removing the resist pattern.

公开(公告)号：US20240215155A1

公开(公告)日：2024-06-27

申请号：US18557020

申请日：2022-01-26

Applicant: NITTO DENKO CORPORATION

Inventor： Makoto TSUNEKAWA

IPC: H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K1/053 ,  H05K3/0044 ,  H05K3/10 ,  H05K2203/0228

Abstract: An assembly sheet includes a wiring circuit board, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer, and a conductive pattern. The frame supports the wiring circuit board. The reinforcement portion is disposed on the frame and reinforces the frame. The reinforcement portion has a first layer made of a metal and a second layer made of a metal.