Invention Publication
- Patent Title: FLUORORESIN COMPOSITION, FLUORORESIN SHEET, LAMINATE AND SUBSTRATE FOR CIRCUITS
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Application No.: US18600472Application Date: 2024-03-08
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Publication No.: US20240215161A1Publication Date: 2024-06-27
- Inventor: Hirokazu KOMORI , Hiroyuki YOSHIMOTO , Masaji KOMORI , Yuki UEDA , Junpei TERADA
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Priority: JP 19003130 2019.01.11
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B5/02 ; B32B15/082 ; B32B15/20 ; B32B17/10 ; B32B27/12 ; B32B27/20 ; B32B27/32 ; C08F214/26 ; C08J5/18 ; C08K3/36 ; C08K7/18

Abstract:
A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.
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