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公开(公告)号：US20240352290A1
公开(公告)日：2024-10-24
申请号：US18640216
申请日：2024-04-19
发明人： Wenxin Cao , Jiaqi Zhu , Ge Gao , Yuwei Zhao , Zhuochao Wang , Kunlong Zhao , Yingqi Liu , Tianyu Zhang , Xiaohui Li
IPC分类号： C09J175/04 , C08G18/28 , C08J3/02 , C08J7/04 , C08K3/04 , C08K3/32 , C08K7/18 , C08K9/02 , C09J5/00
CPC分类号： C09J175/04 , C08G18/2815 , C08J3/02 , C08J7/0427 , C08K3/04 , C08K3/32 , C08K7/18 , C08K9/02 , C09J5/00 , C08G2170/80 , C08G2330/00 , C08J2375/04 , C08K2003/327 , C08K2201/001 , C08K2201/005 , C09J2475/00
摘要： Provided are a method for preparing an organic/inorganic hybrid thermally conductive and insulating two-component adhesive and a method for using the same. The purpose is to solve the problem that thermally conductive adhesives in the prior art cannot meet the requirements of thermal conductivity, good bonding performance and insulation characteristics at the same time. The method includes: 1. preparing an organic phase aluminum dihydrogen phosphate; 2. treating a diamond thermally conductive filler; 3. modifying polyurethane compatible with aluminum dihydrogen phosphate; and 4. preparing an organic/inorganic hybrid insulating two-component adhesive. The use method includes: coating the adhesive onto a surface of a material to be bonded, and bonding; and subjecting a resulting member to be bonded to defoaming, heating, and holding.
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公开(公告)号：US12122954B2
公开(公告)日：2024-10-22
申请号：US18021040
申请日：2021-08-19
IPC分类号： C09K5/10 , C09K23/00 , C09K23/16 , C08K3/14 , C08K3/22 , C08K5/16 , C08K7/18 , C08K13/02 , C09K3/18
CPC分类号： C09K5/10 , C09K23/002 , C09K23/16 , C08K3/14 , C08K3/22 , C08K5/16 , C08K7/18 , C08K13/02 , C09K3/18
摘要： The disclosed technology relates to a heat transfer system and heat transfer method employing stable colloidal dispersion of a) a non-conductive, non-aqueous and non-water miscible dielectric oleaginous heat transfer fluid, b) at least one solid nanoparticle, and c) a surfactant. In particular, the technology relates to a stable colloidal dispersion with low electrical conductivity, low flammability, and low freeze point that provides excellent peak temperature reduction in a heat transfer system, such as that for cooling a battery pack or a power system of an electric vehicle.
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公开(公告)号：US12084553B2
公开(公告)日：2024-09-10
申请号：US17298484
申请日：2019-03-26
发明人： Dong Young Won , Dong Young Kim , Jeong Yeul Choi
CPC分类号： C08J5/18 , C08G73/1032 , C08G73/105 , C08G73/1071 , C08K7/18 , C08J2379/08 , C08K2201/005
摘要： The present invention provides a polyimide film comprising an inorganic filler, which comprises a first filler group having a diameter (D50) of 2-2.7 μm and a second filler group having an average diameter (D50) of 1-1.7 μm, wherein the polyimide film satisfies relation 1: 0.7≤(D90−D10)/(D50)≤1.2, which is about the respective diameters of the first filler group and the second filler group.
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公开(公告)号：US20240294778A1
公开(公告)日：2024-09-05
申请号：US18574333
申请日：2021-07-15
发明人： Yasuhiro YOSHIDA , Natsumi KOYAMA
IPC分类号： C09D5/16 , C08K7/18 , C09D7/40 , C09D7/61 , C09D127/12
CPC分类号： C09D5/1668 , C09D7/61 , C09D7/67 , C09D7/68 , C09D7/69 , C09D7/70 , C09D127/12 , C08K7/18 , C08K2201/005 , C08K2201/011
摘要： A coating film includes a water-repellent resin having a smooth surface and a contact angle of 70 degrees or more. The coating film has a plurality of protrusions formed by the water-repellent resin, and the plurality of protrusions are scattered in the coating film and each have an end portion with a convex surface formed by cutting out a continuous region accounting for 50% or more of a spherical surface. The spherical surfaces each have an average radius of curvature of 16 μm or less. An average distance between each ones of the plurality of protrusions adjacent to each other is less than or equal to 30 times a radius of curvature.
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公开(公告)号：US20240279525A1
公开(公告)日：2024-08-22
申请号：US18566121
申请日：2021-08-19
发明人： Yan Zheng , Dorab Bhagwagar , Qianqing Ge , Peng Wei , Han Guang Wu
IPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K3/22 , C08K3/28 , C08K7/18 , C08K9/08 , C08K13/06 , H05K7/20
CPC分类号： C09K5/14 , C08G77/12 , C08G77/20 , C08K13/06 , H05K7/2039 , C08K2003/2296 , C08K2003/282 , C08K7/18 , C08K9/08 , C08K2201/001 , C08K2201/005
摘要： A composition contains: (A) a curable silicone composition including: (a1) a vinyldimethylsiloxy-terminated polydimethylpolysiloxane having a viscosity in a range of 30-400 milliPascal*seconds, (a2) a silicon-hydride functional crosslinker, and (a3) a hydrosilylation catalyst, where the molar ratio of silicon-hydride functionality from the crosslinker to vinyl functionality is in a range of 0.5:1 to 1:1; (B) a filler treating agent comprising one or both of an alkyl trialkoxysilane and a mono-trialkoxysiloxy terminated dimethylpolysiloxane; and (C) a thermally conductive filler mixture including (c1) 40-55 wt % of aluminum nitride fillers, containing a blend of: (c1-a) 15-41 wt % of spherical aluminum nitride particles having a D50 particle size of 100 micrometers or more, and (c1-b) spherical or irregular shaped aluminum nitride particles having a D50 particle size of 20-80 micrometers; (c2) spherical aluminum oxide particles having a D50 particle size of 1-5 micrometers; and (c3) 10-20 wt % of irregular zinc oxide particles having a D50 particle size of 0.1-0.5 micrometer; where the total amount of the thermally conductive filler mixture is 94-97 wt %; and where wt % values are relative to the weight of the thermally conductive composition unless otherwise stated.
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公开(公告)号：US20240218150A1
公开(公告)日：2024-07-04
申请号：US18563419
申请日：2022-03-31
发明人： Takanori Ito , Megumi Miyano , Junichi Tsukada , Yasuhisa Ishihara , Akihiro Endo , Yuya Hironaka
CPC分类号： C08K3/28 , C08K7/18 , C08L83/04 , C08K2003/2227 , C08K2003/282 , C08K2201/001 , C08K2201/003 , C08K2201/014
摘要： [Problem]
One object of the present invention is to provide a thermally conductive silicone composition in which an increase in viscosity is suppressed when a thermally conductive filler is filled with a high amount level, and a thermally conductive silicone cured product having good thermal conductivity and excellent handling properties.
[Solution]
A thermally conductive silicone composition comprising the following components (A) to (F): (A) an organopolysiloxane having at least two alkenyl groups each bonded to a silicon atom: 100 parts by mass; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms each bonded to a silicon atom in an amount such that a ratio of the number of the hydrogen atom bonded to a silicon atom to the number of the alkenyl group in component (A) is 0.1 to 2; (C) a thermally conductive filler: 4,000 to 7,000 parts by mass; (D) a platinum group metal-based catalyst: a catalyst amount; (E) an addition reaction control agent: 0.01 to 1 part by mass; and (F) a dimethylpolysiloxane having a trialkoxysilyl group at one end of a molecular chain and represented by the formula (1): 100 to 300 parts by mass: wherein R5 is, independently of each other, an alkyl group having 1 to 6 carbon atoms and c is an integer of 5 to 100, wherein the thermally conductive filler (C) comprises, relative to a total mass of component (C), 20 to 50 mass % of aluminum nitride (C1) having a volume median diameter in the range of 50 μm or more and less than 120 μm, 20 to 40 mass % of alumina (C2) having a volume median diameter in the range of 1 μm or more and less than 5 μm, and 2 to 10 mass % of alumina (C3) having a volume median diameter in the range of 0.1 μm or more and less than 1 μm.-
7.发明公开公开(公告)号：US20240092060A1
公开(公告)日：2024-03-21
申请号：US18265566
申请日：2021-11-30
申请人： POSCO Co., Ltd
发明人： Jin-Tae Kim , Dae-Gyu Kang , Yang-Ho Choi , Jung-Hwan Lee
IPC分类号： B32B15/04 , B32B5/20 , B32B15/18 , C08J9/00 , C08J9/10 , C08K3/36 , C08K5/11 , C08K5/14 , C08K7/18 , C09D5/00 , C09D7/40 , C09D7/61 , C09D7/63 , C09D127/06 , C09D133/08
CPC分类号： B32B15/046 , B32B5/20 , B32B15/18 , C08J9/0023 , C08J9/103 , C08K3/36 , C08K5/11 , C08K5/14 , C08K7/18 , C09D5/002 , C09D7/61 , C09D7/63 , C09D7/69 , C09D7/70 , C09D127/06 , C09D133/08 , B32B2250/02 , B32B2255/06 , B32B2255/26 , B32B2266/0235 , B32B2266/104 , B32B2307/102 , B32B2307/56 , B32B2307/7376 , C08J2327/06
摘要： Provided is an unconstrained vibration damping metal sheet with foam pores. The unconstrained vibration damping metal sheet of the present invention comprises: a metal sheet; an organic-inorganic pretreatment layer containing an acrylic resin formed on the metal sheet; and a foam resin layer formed on the pretreatment layer, the foam resin layer containing, based on weight % thereof, a thermoplastic polyvinyl chloride resin: 40-80%, a plasticizer: 5-40%, a foaming agent: 0.1-10%, an oxide-based crosslinker: 1-4%, and spherical silica: 1-10%.
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公开(公告)号：US11926683B2
公开(公告)日：2024-03-12
申请号：US16626812
申请日：2018-06-29
发明人： Yutaka Obata , Haruhiko Mori
IPC分类号： C08F20/18 , B29C45/00 , B29C45/02 , B29K33/04 , B29K105/00 , B29K507/04 , B29K509/08 , C08K3/04 , C08K3/22 , C08K3/36 , C08K7/18 , C08K9/06
CPC分类号： C08F20/18 , B29C45/0001 , B29C45/02 , C08K3/04 , C08K3/22 , C08K3/36 , C08K7/18 , C08K9/06 , B29K2033/04 , B29K2105/0002 , B29K2105/0032 , B29K2507/04 , B29K2509/08 , C08K2003/2241 , C08K2201/003 , C08K2201/011 , C08K2201/014
摘要： The present invention provides a thermosetting material, which contains the following components (A) to (C) and which, when measured with a rotational viscometer at a constant shear rate (JIS K7117-2:1999), exhibits a viscosity at 25° C. and 10 s−1 of 5 Pa·s or more and 200 Pa·s or less and, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity at 25° C. and a shear rate of 100 s−1 of 0.3 Pa·s or more and 50 Pa·s or less. (A): a (meth) acrylate compound in which a substituted or unsubstituted alicyclic hydrocarbon group having 6 or more carbon atoms is ester-bonded, and which, when measured with a rotational viscometer at a constant shear rate in the same manner as above, exhibits a viscosity of 5 to 300 mPa·s as a viscosity measured at 25° C. and 10 to 100 s−1; (B): spherical silica; and (C): a black pigment.
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公开(公告)号：US11891545B2
公开(公告)日：2024-02-06
申请号：US16934800
申请日：2020-07-21
发明人： Wanshuang Liu , Hebin Luo , Yi Wei
IPC分类号： C09J163/00 , C09J9/02 , C09J4/06 , C08K3/08 , C08K7/18
CPC分类号： C09J163/00 , C09J4/06 , C09J9/02 , C08K3/08 , C08K7/18 , C08K2003/0806 , C08K2201/005 , C08K2201/011
摘要： The present invention refers to a composition, a low halogen and fast curing conductive adhesive and its preparation method. The composition includes the following raw materials measured by weight: epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer 2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts. The low halogen and fast curing conductive adhesive of the present invention has the advantages of fast curing (within 10 min), low halogen content, high bond strength, good moisture-heat aging resistance, good electric conductivity and thermal conductivity and so on, and has wide application prospects in the field of microelectronic packaging.
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公开(公告)号：US20240002715A1
公开(公告)日：2024-01-04
申请号：US18031756
申请日：2022-01-28
申请人： LG Chem, Ltd.
发明人： Hye Jin Kim , Je Sik Jung , Hyoung Sook Park , Jin Hyeok Won , Sung Bum Hong , Sol Yi Lee , Jong Hun Choi , Sang Hyuk Seo , Jae Min Jung
CPC分类号： C09K5/14 , C08K7/18 , C08G18/4286 , C08G18/73 , C08G18/755 , C08K2201/005 , C08G18/791 , H05K7/2039 , C08K2201/001 , C08K2201/014 , C08G18/722
摘要： According to the present invention, it is possible to provide a composition comprising a resin component and a filler component comprising a filler having a specific gravity of 3 or more and a filler having a specific gravity of less than 3, which achieves a low specific gravity effect in a state where a filler is filled in a high content and in a state where realization of physical properties is sufficiently secured, and has improved storage stability without deterioration of physical properties such as a thermal conductivity, and a product comprising a heating element and the composition or a cured product thereof in thermal contact with the heating element.
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