Technologies for die recycling for high yield packaging is disclosed. In the illustrative embodiment, a release layer is deposited on one or more dies. The release layer includes conductive pads and a dielectric layer. Both the conductive pads and the dielectric layer have melting points between a temperature at which the die assembly will be processed and a temperature at which the die may sustain damage. One or more layers such as redistribution layers are deposited on the release layer. If a fault is discovered in the redistribution layers, the die assembly can be heated up past the melting point of the release layer, allowing the die to be removed. The die can then be cleaned and recycled for another packaging attempt.