Invention Publication
- Patent Title: PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE BY USING THE SAME
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Application No.: US18403927Application Date: 2024-01-04
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Publication No.: US20240241438A1Publication Date: 2024-07-18
- Inventor: Sung Hwan PARK , Hyun-Ji Song , Juhyeon Park , Sungmin Ko , Sounghyun Jun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230006989 2023.01.17
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039
Abstract:
A photoresist composition that includes a photosensitive polymer that can be cut by a chain scission mechanism due to light, a radical quencher including a phenol-based compound, and a photoactive compound (PAC) are provided.
Public/Granted literature
- US1767588A Apparatus for proportioning and controlling the rates of flow of fluids Public/Granted day:1930-06-24
Information query
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