公开(公告)号：US20240241438A1

公开(公告)日：2024-07-18

申请号：US18403927

申请日：2024-01-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hwan PARK ,  Hyun-Ji Song ,  Juhyeon Park ,  Sungmin Ko ,  Sounghyun Jun

IPC: G03F7/004 ,  G03F7/039

CPC classification number: G03F7/0045 ,  G03F7/039

Abstract: A photoresist composition that includes a photosensitive polymer that can be cut by a chain scission mechanism due to light, a radical quencher including a phenol-based compound, and a photoactive compound (PAC) are provided.