Invention Publication
- Patent Title: CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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Application No.: US18382278Application Date: 2023-10-20
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Publication No.: US20240268034A1Publication Date: 2024-08-08
- Inventor: Jesang Park , Changgun Oh , Yangje Lee , Hyun Kyung Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR 20230015439 2023.02.06
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K1/03 ; H05K3/46

Abstract:
A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.
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