公开(公告)号：US20240275035A1

公开(公告)日：2024-08-15

申请号：US18386462

申请日：2023-11-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yangje Lee ,  Jesang Park ,  Changgun Oh ,  Hyun Kyung Park

IPC: H01Q1/42 ,  H01Q9/04

CPC classification number: H01Q1/422 ,  H01Q9/0414 ,  H01Q1/38

Abstract: An antenna board according to an embodiment includes: a first insulating layer having a first relative dielectric constant; at least one first antenna member that is disposed inside the first insulating layer and has a first main surface with a maximum area; a second insulating layer that is disposed adjacent to the first insulating layer and has a second relative dielectric constant that is higher than the first relative dielectric constant; and at least one second antenna member that is disposed inside the second insulating layer and has a second main surface that has a maximum area and is disposed to such that the main surface of the second antenna member faces toward a plane which is 90 degree or less from the first main surface.

公开(公告)号：US20240268034A1

公开(公告)日：2024-08-08

申请号：US18382278

申请日：2023-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jesang Park ,  Changgun Oh ,  Yangje Lee ,  Hyun Kyung Park

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/103 ,  H05K1/0306 ,  H05K3/4697 ,  H05K2201/0212 ,  H05K2201/0753 ,  H05K2201/099 ,  H05K2201/10204 ,  H05K2203/0186 ,  H05K2203/1377

Abstract: A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.