- 专利标题： INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
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申请号： US18169998申请日： 2023-02-16
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公开(公告)号： US20240282658A1公开(公告)日： 2024-08-22
- 发明人: John Knickerbocker , Mukta Ghate Farooq , Keiji Matsumoto
- 申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 申请人地址： US NY ARMONK
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY ARMONK
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56 ; H01L23/00 ; H01L23/29 ; H01L23/367
摘要：
A semiconductor integrated circuit device includes a first back-end-of-line region coupled to a first side of a front-end-of-line region, a second back-end-of-line region coupled to a second side of the front-end-of-line region, and a thermally conducting solder at least partially surrounding a perimeter of the front-end-of-line region, the first back-end-of-line region and the second back-end-of-line region.
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