- 专利标题: MULTI-HEAD DESIGN FOR ULTRASONIC IMPACT GRINDING OF CMCS
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申请号: US18185867申请日: 2023-03-17
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公开(公告)号: US20240308015A1公开(公告)日: 2024-09-19
- 发明人: Zhigang Wang , Andrzej E. Kuczek , Robin H. Fernandez , John D. Riehl , Alan C. Barron , Ahmed Abdillahi Abdi , Jason Nelson , Andrew Joseph Lazur
- 申请人: Raytheon Technologies Corporation
- 申请人地址: US VA Arlington
- 专利权人: Raytheon Technologies Corporation
- 当前专利权人: Raytheon Technologies Corporation
- 当前专利权人地址: US VA Arlington
- 主分类号: B24B1/04
- IPC分类号: B24B1/04 ; B24B57/02 ; B25J9/00 ; B25J9/02 ; B25J9/16 ; B25J11/00
摘要:
An ultrasonic impact grinding assembly includes a base with a mount for connecting a workpiece to the base and a first tool arm. The ultrasonic impact grinding assembly also includes a second tool arm. The first tool arm and the second tool arm each include a base end, a distal end, at least one joint between the base end and the distal end, and at least one actuator configured to move the at least one joint. A first ultrasonic impact grinding tool head is connected to the distal end of the first tool arm. A second ultrasonic impact grinding tool head is connected to the distal end of the second tool arm.
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