- 专利标题： COMPRESSIVE FILMS FOR LARGE AREA GAPFILL
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申请号： US18192549申请日： 2023-03-29
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公开(公告)号： US20240332028A1公开(公告)日： 2024-10-03
- 发明人: Supriya Ghosh , Zeqing Shen , Susmit Singha Roy , Abhijit Basu Mallick
- 申请人： Applied Materials, Inc.
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L21/3105
- IPC分类号： H01L21/3105 ; H01J37/32 ; H01L21/02
摘要：
Exemplary methods of semiconductor processing may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the semiconductor processing chamber. The methods may include forming a silicon-containing material on the substrate. The silicon-containing material may be characterized by a stress of greater than or about −200 MPa. The methods may include annealing the substrate at a temperature of greater than or about 700° C.
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