- 专利标题: Heatsink techniques for optical and electrical modules
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申请号: US18745045申请日: 2024-06-17
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公开(公告)号: US20240339767A1公开(公告)日: 2024-10-10
- 发明人: Mitchell O'Leary , Victor Aldea , Kamran Rahmani , Trevor Meunier , Peter Ajersch , Terence Graham , Marc Leclair
- 申请人: Ciena Corporation
- 申请人地址: US MD Hanover
- 专利权人: Ciena Corporation
- 当前专利权人: Ciena Corporation
- 当前专利权人地址: US MD Hanover
- 主分类号: H01R4/48
- IPC分类号: H01R4/48 ; H01L23/40 ; H01R4/30
摘要:
A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly; components disposed on a primary side of the printed circuit board assembly; a primary side heatsink for a pluggable module, wherein the primary side heatsink is disposed to one or more pivot points on the pluggable module, for applying a uniform and controlled external force against the pluggable module. The module further includes a cage attached to the printed circuit board assembly for supporting the pluggable module, wherein the one or more pivot points are external to the cage.
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