- 专利标题: MANAGING ADHESIVE MATERIAL SHAPING USING STRUCTURE ARRAYS
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申请号: US18325174申请日: 2023-05-30
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公开(公告)号: US20240345336A1公开(公告)日: 2024-10-17
- 发明人: Raphael Beaupré-Laflamme , Nicolas Boyer , François Pelletier , Simon Savard , Veronique Jomphe Allain , Luc Bélanger
- 申请人: Ciena Corporation
- 申请人地址: US MD Hanover
- 专利权人: Ciena Corporation
- 当前专利权人: Ciena Corporation
- 当前专利权人地址: US MD Hanover
- 主分类号: G02B6/42
- IPC分类号: G02B6/42
摘要:
An article of manufacture comprises: at least a portion of a wafer comprising a substate and one or more layers fabricated on the substrate; one or more integrated photonic structures in the portion of the wafer, where at least a first integrated photonic structure of the one or more integrated photonic structures is associated with an electromagnetic wave propagation region that extends beyond a first surface of a first layer of the one or more layers; an array of structures arranged in a two-dimensional pattern on a portion of the first surface; and an adhesive material making contact with the first surface and with at least a majority of the structures in the array of structures.
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