公开(公告)号：US20240345336A1

公开(公告)日：2024-10-17

申请号：US18325174

申请日：2023-05-30

申请人： Ciena Corporation

发明人： Raphael Beaupré-Laflamme ,  Nicolas Boyer ,  François Pelletier ,  Simon Savard ,  Veronique Jomphe Allain ,  Luc Bélanger

IPC分类号： G02B6/42

CPC分类号： G02B6/4212 ,  G02B6/4215 ,  G02B6/4279

摘要： An article of manufacture comprises: at least a portion of a wafer comprising a substate and one or more layers fabricated on the substrate; one or more integrated photonic structures in the portion of the wafer, where at least a first integrated photonic structure of the one or more integrated photonic structures is associated with an electromagnetic wave propagation region that extends beyond a first surface of a first layer of the one or more layers; an array of structures arranged in a two-dimensional pattern on a portion of the first surface; and an adhesive material making contact with the first surface and with at least a majority of the structures in the array of structures.