- 专利标题： ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
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申请号： US18634665申请日： 2024-04-12
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公开(公告)号： US20240347575A1公开(公告)日： 2024-10-17
- 发明人: Jin Young Kim , No Sun Park , Yoon Joo Kim , Seung Jae Lee , Se Woong Cha , Sung Kyu Kim , Ju Hoon Yoon
- 申请人： Amkor Technology Singapore Holding Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人： Amkor Technology Singapore Holding Pte. Ltd.
- 当前专利权人地址： SG Singapore
- 优先权： KR 20120131963 2012.11.20
- 主分类号： H01L27/146
- IPC分类号： H01L27/146 ; G06V40/12 ; H01L21/56 ; H01L23/00 ; H01L23/498 ; H01L23/528
摘要：
Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
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