公开(公告)号：US20220415769A1

公开(公告)日：2022-12-29

申请号：US17897556

申请日：2022-08-29

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jae Yun Kim ,  Gi Tae Lim ,  Woon Kab Jung ,  Ju Hoon Yoon ,  Dong Joo Park ,  Byong Woo Cho ,  Gyu Wan Han ,  Ji Young Chung ,  Jin Seong Kim ,  Do Hyun Na

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/50 ,  H01L23/00 ,  H01L23/538

摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

公开(公告)号：US20220293482A1

公开(公告)日：2022-09-15

申请号：US17555790

申请日：2021-12-20

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Khim ,  Ji Young Chung ,  Ju Hoon Yoon ,  Kwang Woong Ahn ,  Ho Jeong Lim ,  Tae Yong Lee ,  Jae Min Bae

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L21/683 ,  H01L21/768 ,  H01L23/48 ,  H01L23/00

摘要： A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a stackable semiconductor device with small size and fine pitch and a method of manufacturing thereof.

公开(公告)号：US11183493B2

公开(公告)日：2021-11-23

申请号：US16545105

申请日：2019-08-20

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  Doo Hyun Park ,  Ju Hoon Yoon ,  Seong Min Seo ,  Glenn Rinne ,  Choon Heung Lee

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L21/56

摘要： Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

公开(公告)号：US11961867B2

公开(公告)日：2024-04-16

申请号：US17837702

申请日：2022-06-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  G06V40/12 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/56

CPC分类号： H01L27/14636 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5286 ,  H01L24/19 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14678 ,  G06V40/12 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US20220375985A1

公开(公告)日：2022-11-24

申请号：US17837702

申请日：2022-06-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US12107035B2

公开(公告)日：2024-10-01

申请号：US17897556

申请日：2022-08-29

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jae Yun Kim ,  Gi Tae Lim ,  Woon Kab Jung ,  Ju Hoon Yoon ,  Dong Joo Park ,  Byong Woo Cho ,  Gyu Wan Han ,  Ji Young Chung ,  Jin Seong Kim ,  Do Hyun Na

IPC分类号： H01L23/498 ,  H01L21/50 ,  H01L23/00 ,  H01L23/31 ,  H01L23/538

CPC分类号： H01L23/49811 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/92 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/92225 ,  H01L2224/92242 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/8321 ,  H01L2924/00014 ,  H01L2224/83203 ,  H01L2924/00014 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/293 ,  H01L2924/00014 ,  H01L2224/92242 ,  H01L2224/81 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/1329 ,  H01L2924/00014 ,  H01L2224/133 ,  H01L2924/00014

摘要： A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

公开(公告)号：US20220181314A1

公开(公告)日：2022-06-09

申请号：US17532601

申请日：2021-11-22

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  Doo Hyun Park ,  Ju Hoon Yoon ,  Seong Min Seo ,  Glenn Rinne ,  Choon Heung Lee

IPC分类号： H01L25/00 ,  H01L25/065

摘要： Provided are a semiconductor device using, for example, an epoxy molding compound (EMC) wafer support system and a fabricating method thereof, which can, for example, adjust a thickness of the overall package in a final stage of completing the device while shortening a fabricating process and considerably reducing the fabrication cost. An example semiconductor device may comprise a first semiconductor die that comprises a bond pad and a through silicon via (TSV) connected to the bond pad; an interposer comprising a redistribution layer connected to the bond pad or the TSV and formed on the first semiconductor die, a second semiconductor die connected to the redistribution layer of the interposer and positioned on the interposer; an encapsulation unit encapsulating the second semiconductor die, and a solder ball connected to the bond pad or the TSV of the first semiconductor die.

公开(公告)号：US20240347575A1

公开(公告)日：2024-10-17

申请号：US18634665

申请日：2024-04-12

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  G06V40/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528

CPC分类号： H01L27/14636 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5286 ,  H01L24/19 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14678 ,  G06V40/12 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US11362128B2

公开(公告)日：2022-06-14

申请号：US16907860

申请日：2020-06-22

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/56 ,  G06V40/12

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.