公开(公告)号：US11961867B2

公开(公告)日：2024-04-16

申请号：US17837702

申请日：2022-06-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  G06V40/12 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/56

CPC分类号： H01L27/14636 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5286 ,  H01L24/19 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14678 ,  G06V40/12 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US20220375985A1

公开(公告)日：2022-11-24

申请号：US17837702

申请日：2022-06-10

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US20240347575A1

公开(公告)日：2024-10-17

申请号：US18634665

申请日：2024-04-12

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  G06V40/12 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528

CPC分类号： H01L27/14636 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5286 ,  H01L24/19 ,  H01L24/20 ,  H01L27/14618 ,  H01L27/14678 ,  G06V40/12 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

公开(公告)号：US11362128B2

公开(公告)日：2022-06-14

申请号：US16907860

申请日：2020-06-22

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Jin Young Kim ,  No Sun Park ,  Yoon Joo Kim ,  Seung Jae Lee ,  Se Woong Cha ,  Sung Kyu Kim ,  Ju Hoon Yoon

IPC分类号： H01L27/146 ,  H01L23/00 ,  H01L23/498 ,  H01L23/528 ,  H01L21/56 ,  G06V40/12

摘要： Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.