Invention Publication
- Patent Title: AMBIENT TEMPERATURE SINTERABLE SILVER NANOALLOY INKS AND PASTES
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Application No.: US18630630Application Date: 2024-04-09
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Publication No.: US20240351105A1Publication Date: 2024-10-24
- Inventor: Chuan-Jian Zhong , Richard Robinson , Shan Wang , Shan Yan , Guojun Shang
- Applicant: The Research Foundation for the State University of New York
- Applicant Address: US NY Albany
- Assignee: The Research Foundation for the State University of New York
- Current Assignee: The Research Foundation for the State University of New York
- Current Assignee Address: US NY Albany
- Main IPC: B22F9/24
- IPC: B22F9/24 ; B22F1/0545 ; B82Y30/00 ; C09D11/033 ; C09D11/037
Abstract:
Nanoparticles with a bimetallic silver-copper (AgCu) alloy composition with ambient (room temperature) sintering properties. The bimetallic alloy is formulated with nanoparticles which are contained in a stable nanoink or nanopaste. The nanoink or nanopaste can be printed on paper and other substrates and be sintered under room temperatures. A method of creating the AgCu composition is also provided.
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