- 专利标题: METHOD FOR TRANSPORTING WAFERS
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申请号: US18758239申请日: 2024-06-28
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公开(公告)号: US20240355659A1公开(公告)日: 2024-10-24
- 发明人: Wei-Chih CHEN , Shi-Chi CHEN , Ting-Wei WANG , Jen-Ti WANG , Kuo-Fong CHUANG
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 分案原申请号: US17748932 2022.05.19
- 主分类号: H01L21/677
- IPC分类号: H01L21/677 ; H01L21/67
摘要:
A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.
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