METHOD FOR CLEANING LOAD PORT OF WAFER PROCESSING APPARATUS
    2.
    发明申请
    METHOD FOR CLEANING LOAD PORT OF WAFER PROCESSING APPARATUS 审中-公开
    清洗加工装置加载端口的方法

    公开(公告)号:US20170049284A1

    公开(公告)日:2017-02-23

    申请号:US14832173

    申请日:2015-08-21

    摘要: A cleaning module adapted for cleaning a load port of a processing apparatus in semiconductor fabrication is provided. The cleaning module includes a housing having at least one opening formed on a bottom wall panel of the housing. The cleaning module further includes a filter unit positioned in the housing. The leaning module also includes a driving assembly. The driving assembly is arranged to correspond to the opening and positioned in the housing. The driving assembly is used to create an air flow from outside of the housing via the opening to the filter unit. The filter unit is used to separate particles or contaminants from the air flow.

    摘要翻译: 提供了一种用于清洁半导体制造中的处理装置的负载端口的清洁模块。 清洁模块包括具有形成在壳体的底壁面板上的至少一个开口的壳体。 清洁模块还包括定位在壳体中的过滤器单元。 倾斜模块还包括驱动组件。 驱动组件布置成对应于开口并且定位在壳体中。 驱动组件用于从壳体的外部经由开口到过滤器单元产生空气流。 过滤器单元用于从空气流中分离颗粒或污染物。

    AUTOMATED MATERIAL HANDLING SYSTEM FOR USE IN POWER OUTAGE RECOVERY

    公开(公告)号:US20230411193A1

    公开(公告)日:2023-12-21

    申请号:US17843228

    申请日:2022-06-17

    IPC分类号: H01L21/677

    CPC分类号: H01L21/67724

    摘要: When there is an interruption in power to an area of an integrated circuit manufacturing facility, product may be stranded in a vehicle mounted to an automated material handling system. An automated rescue vehicle can be deployed to retrieve the stranded vehicle so that a payload carried by that vehicle can be recovered and processing can resume. The rescue vehicle can carry a battery payload. The battery payload provides backup power while the rescue operation is performed. With such an automated system, no human intervention is needed to recover product during a power outage. In addition to improving wafer throughput during the power outage, such a rescue operation may prevent quality degradation for time-critical sequences of processing operations.

    METHOD FOR TRANSPORTING WAFERS
    6.
    发明公开

    公开(公告)号:US20240355659A1

    公开(公告)日:2024-10-24

    申请号:US18758239

    申请日:2024-06-28

    IPC分类号: H01L21/677 H01L21/67

    摘要: A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport device, reading data of a rail mark located on the transport rail; aligning an orientation of the wafer transport device according to the data of the rail mark; after aligning the orientation of the wafer transport device according to the data of the rail mark, aligning the wafer transport device with respect to a top surface of the load port; after aligning the wafer transport device with respect to the top surface of the load port, lowering the hoist unit.

    METHOD FOR TRANSPORTING WAFERS
    7.
    发明申请

    公开(公告)号:US20220285190A1

    公开(公告)日:2022-09-08

    申请号:US17748932

    申请日:2022-05-19

    IPC分类号: H01L21/677 H01L21/67

    摘要: A method includes moving a wafer transport device to a position above a load port; lowering a hoist unit of the wafer transport device above the load port, wherein the wafer transport device has a plurality of belts, each of the belts is connected to the hoist unit and wound around a respective belt winding drum; detecting sound waves from the belts by using at least one acoustic sensor to measure tensions of the belts; and comparing the tensions from the belts to determine an inclination of the hoist unit.