- 专利标题： SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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申请号： US18497039申请日： 2023-10-30
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公开(公告)号： US20240355794A1公开(公告)日： 2024-10-24
- 发明人: Choongbin Yim , Jongkook Kim , Chengtar Wu
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR 20230051537 2023.04.19
- 主分类号： H01L25/10
- IPC分类号： H01L25/10 ; H01L21/48 ; H01L21/56 ; H01L23/00 ; H01L23/31 ; H01L23/373 ; H01L23/498 ; H10B80/00
摘要：
A semiconductor package may include: a redistribution layer structure; a semiconductor structure on the redistribution layer structure; a printed circuit board on the redistribution layer structure and extending around a side surface of the semiconductor structure; a molding material extending around the semiconductor structure on the redistribution layer structure; and a silicon interposer on the printed circuit board and the molding material.
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