- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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申请号: US18385537申请日: 2023-10-31
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公开(公告)号: US20240355883A1公开(公告)日: 2024-10-24
- 发明人: Hyumin YOO , Myung Gil KANG , Dongwon KIM , Jongsu KIM , Beomjin PARK , Byeonghee SON
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20230050606 2023.04.18
- 主分类号: H01L29/08
- IPC分类号: H01L29/08 ; H01L21/8238 ; H01L27/092 ; H01L29/775 ; H01L29/786
摘要:
A semiconductor device includes a substrate including an active pattern; a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns, which are stacked to be spaced apart from each other; a source/drain pattern connected to the plurality of semiconductor patterns; a gate electrode on the plurality of semiconductor patterns; and a blocking layer between the source/drain pattern and the active pattern, wherein the source/drain pattern includes a protruding side surface protruding toward the semiconductor patterns, the blocking layer includes silicon-germanium (SiGe), and a germanium concentration of the blocking layer is higher than a germanium concentration of the source/drain pattern.
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