- 专利标题： HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
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申请号： US18641621申请日： 2024-04-22
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公开(公告)号： US20240365465A1公开(公告)日： 2024-10-31
- 发明人: Yoshihito OTSUBO , Takuma KUROYANAGI , Tomomi YASUDA
- 申请人： Murata Manufacturing Co., Ltd.
- 申请人地址： JP Kyoto
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JP Kyoto
- 优先权： JP 23074060 2023.04.28
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
A high frequency module includes a mounting board, a first electronic component, a second electronic component, and a shield member. The mounting board has a main surface. The first electronic component and the second electronic component are disposed on the main surface of the mounting board. The shield member is disposed on the main surface of the mounting board. The shield member is positioned between the first electronic component and the second electronic component, and is adjacent to the first electronic component and the second electronic component.
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