公开(公告)号：US20240014805A1

公开(公告)日：2024-01-11

申请号：US18474261

申请日：2023-09-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomomi YASUDA ,  Syunsuke KIDO ,  Masanori KATO ,  Takanori UEJIMA ,  Masanari MIURA ,  Naru MORITO ,  Yukiya YAMAGUCHI ,  Takuma KUROYANAGI ,  Yuuki FUKUDA

IPC: H03H9/54 ,  H03F3/24 ,  H04B1/40

CPC classification number: H03H9/542 ,  H03F3/245 ,  H04B1/40 ,  H03F2200/294 ,  H03F2200/451

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, and a first radio-frequency component, wherein a pass band width of the hybrid filter is greater than a resonant band width of the first acoustic wave resonator, one of the first acoustic wave resonator, the first inductor, and the first capacitor is disposed on the main surface, and the first radio-frequency component is disposed on the main surface.

公开(公告)号：US20240365465A1

公开(公告)日：2024-10-31

申请号：US18641621

申请日：2024-04-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Takuma KUROYANAGI ,  Tomomi YASUDA

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K1/0218 ,  H05K1/0242 ,  H05K2201/0715

Abstract: A high frequency module includes a mounting board, a first electronic component, a second electronic component, and a shield member. The mounting board has a main surface. The first electronic component and the second electronic component are disposed on the main surface of the mounting board. The shield member is disposed on the main surface of the mounting board. The shield member is positioned between the first electronic component and the second electronic component, and is adjacent to the first electronic component and the second electronic component.

公开(公告)号：US20230318573A1

公开(公告)日：2023-10-05

申请号：US18329607

申请日：2023-06-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syunsuke KIDO ,  Naru MORITO ,  Takanori UEJIMA ,  Masanari MIURA ,  Yukiya YAMAGUCHI ,  Takuma KUROYANAGI ,  Tomomi YASUDA ,  Masanori KATO ,  Yuuki FUKUDA

IPC: H03H9/64

CPC classification number: H03H9/6406

Abstract: A hybrid filter includes a module substrate having a major surface and a major surface that are opposite to each other, acoustic wave resonator elements disposed at the module substrate, inductors disposed at the module substrate, and a capacitor disposed at the module substrate. The pass band of the hybrid filter is wider than the resonance band width of the acoustic wave resonator elements. One of the acoustic wave resonator elements, the inductors, and the capacitor is a first circuit element, and the first circuit element is disposed at the major surface. Another of the acoustic wave resonator elements, the inductors, and the capacitor is a second circuit element, and the second circuit element is disposed at the major surface.

公开(公告)号：US20190320531A1

公开(公告)日：2019-10-17

申请号：US16451615

申请日：2019-06-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomomi YASUDA

IPC: H05K1/11 ,  H01L25/18 ,  H01L23/498 ,  H01L23/13 ,  H01L23/00 ,  H05K1/18

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).

公开(公告)号：US20240014804A1

公开(公告)日：2024-01-11

申请号：US18472237

申请日：2023-09-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syunsuke KIDO ,  Takanori UEJIMA ,  Naru MORITO ,  Masanari MIURA ,  Yukiya YAMAGUCHI ,  Takuma KUROYANAGI ,  Tomomi YASUDA ,  Masanori KATO ,  Yuuki FUKUDA

IPC: H03H9/54 ,  H03F3/24

CPC classification number: H03H9/542 ,  H03F3/245 ,  H03F2200/451 ,  H03F2200/294

Abstract: A radio-frequency module includes a module substrate having main surfaces opposite to each other, a hybrid filter having a first acoustic wave resonator, a first inductor, and a first capacitor, a switch for connecting and disconnecting an antenna connection terminal and the hybrid filter, and a coupler disposed on a path linking the antenna connection terminal and the switch. The first acoustic wave resonator is disposed on the main surface, the switch is included in a semiconductor IC disposed on the main surface, the coupler is disposed inside the module substrate, and in plan view of the module substrate, the semiconductor IC at least partially overlaps the first acoustic wave resonator, and the semiconductor IC and the coupler at least partially overlaps.

公开(公告)号：US20220394844A1

公开(公告)日：2022-12-08

申请号：US17662097

申请日：2022-05-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yutaka SHUTO ,  Hiroshi NISHIKAWA ,  Tomomi YASUDA

IPC: H05K1/02 ,  H05K1/11

Abstract: A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

公开(公告)号：US20240030955A1

公开(公告)日：2024-01-25

申请号：US18473327

申请日：2023-09-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masanari MIURA ,  Naru MORITO ,  Masanori KATO ,  Syunsuke KIDO ,  Tomomi YASUDA ,  Takanori UEJIMA ,  Takuma KUROYANAGI ,  Yukiya YAMAGUCHI ,  Yuuki FUKUDA

IPC: H04B1/38 ,  H03H9/25 ,  H01Q1/38 ,  H01Q1/22 ,  H01Q15/24

CPC classification number: H04B1/38 ,  H03H9/25 ,  H01Q1/38 ,  H01Q1/2283 ,  H01Q15/24 ,  H01Q1/2208

Abstract: A radio-frequency module includes a module substrate, a hybrid filter for 5th Generation New Radio (5G-NR) n77 including a first acoustic wave resonator element, a first inductor, and a first capacitor, a filter for 5G-NR n79 including a second acoustic wave resonator element and a second inductor, power amplifiers, a third inductor coupled between the power amplifier and the hybrid filter, and a fourth inductor coupled between the power amplifier and the filter. The first inductor, the second inductor, the third inductor, and the fourth inductor are disposed at a major surface or inside the module substrate. The distance between the first inductor and the third inductor is larger than the distance between the second inductor and the fourth inductor.

公开(公告)号：US20240030894A1

公开(公告)日：2024-01-25

申请号：US18477705

申请日：2023-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masanari MIURA ,  Naru MORITO ,  Masanori KATO ,  Syunsuke KIDO ,  Tomomi YASUDA ,  Takanori UEJIMA ,  Takuma KUROYANAGI ,  Yukiya YAMAGUCHI ,  Yuuki FUKUDA

IPC: H03H9/54 ,  H03F3/24 ,  H03F1/56

CPC classification number: H03H9/542 ,  H03F3/245 ,  H03F1/56 ,  H03F2200/451 ,  H03F2200/222 ,  H03F2200/387

Abstract: A radio-frequency module includes a hybrid filter for 5th Generation New Radio (5G-NR) n77, a filter for 5G-NR n79, power amplifiers, a third inductor coupled to the power amplifier, and a fourth inductor coupled to a power amplifier. When a module substrate is viewed in plan view, the power amplifiers are disposed in a first quadrant, the third inductor and the fourth inductor are disposed in a second quadrant, the hybrid filter and the filter are disposed in a third quadrant, the power amplifier is disposed closer to a reference point than the power amplifier, the third inductor is disposed closer to the reference point than the fourth inductor, and the hybrid filter is disposed closer to the reference point than the filter.

公开(公告)号：US20210298171A1

公开(公告)日：2021-09-23

申请号：US17339595

申请日：2021-06-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomomi YASUDA

IPC: H05K1/11 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L25/18 ,  H05K1/18

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (30) and a second electronic component (40) mounted on a main surface (10a) of the substrate (10). The substrate (10) has a protruding portion (20) projecting from the main surface (10a), the first electronic component (30) is mounted in a region of the main surface (10a) different from a region in which the protruding portion (20) is provided, and the second electronic component (40) is mounted on the protruding portion (20).