Invention Application
- Patent Title: MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
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Application No.: US18775933Application Date: 2024-07-17
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Publication No.: US20240368336A1Publication Date: 2024-11-07
- Inventor: Daiki SUGIYAMA
- Applicant: MITSUBISHI CHEMICAL CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee: MITSUBISHI CHEMICAL CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2022-005567 20220118
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08G59/22 ; C08G63/91 ; C08J5/24 ; C09D163/00 ; C09J163/00

Abstract:
The present invention provides a modified epoxy resin including a structural unit derived from an epoxy compound, and a structural unit derived from an acid-terminated polyester, wherein the modified epoxy resin has a weight average molecular weight of from 1,500 to 50,000, and an epoxy equivalent of from 500 to 10,000 g/eq, and wherein the modified epoxy resin is represented by the following formula (1) (wherein, in the formula (1), n represents a number from 1 to 30, X is a structural unit derived from an epoxy compound, and Y is a structural unit derived from an acid-terminated polyester).
Information query
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