Invention Application
- Patent Title: Full Die and Partial Die Tape Outs from Common Design
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Application No.: US18791165Application Date: 2024-07-31
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Publication No.: US20240394461A1Publication Date: 2024-11-28
- Inventor: Haim Hauzi , Eran Tamari , Per H. Hammarlund , Jonathan M. Redshaw , Alfredo Kostianovsky , Idan Nissel , Leonid Gitelman , Oren Betzalel , Dalia Haim , Lior Zimet
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: G06F30/398
- IPC: G06F30/398 ; G03F1/70 ; G06F30/392

Abstract:
A chip design methodology and a set of integrated circuits that are taped out from a common design database are disclosed. The area of a full instance of the integrated circuit is defined, and one or more chop lines are defined to identify portions that will be removed for one or more partial instances. A variety of techniques and mechanisms are defined to permit the tape outs to occur from a common design database, so that the effort to tape out partial instances may be minimized beyond that to tape out the full instance.
Information query