公开(公告)号：US20240394461A1

公开(公告)日：2024-11-28

申请号：US18791165

申请日：2024-07-31

Applicant: Apple Inc.

Inventor： Haim Hauzi ,  Eran Tamari ,  Per H. Hammarlund ,  Jonathan M. Redshaw ,  Alfredo Kostianovsky ,  Idan Nissel ,  Leonid Gitelman ,  Oren Betzalel ,  Dalia Haim ,  Lior Zimet

IPC: G06F30/398 ,  G03F1/70 ,  G06F30/392

Abstract: A chip design methodology and a set of integrated circuits that are taped out from a common design database are disclosed. The area of a full instance of the integrated circuit is defined, and one or more chop lines are defined to identify portions that will be removed for one or more partial instances. A variety of techniques and mechanisms are defined to permit the tape outs to occur from a common design database, so that the effort to tape out partial instances may be minimized beyond that to tape out the full instance.

公开(公告)号：US20230053664A1

公开(公告)日：2023-02-23

申请号：US17873694

申请日：2022-07-26

Applicant: Apple Inc.

Inventor： Haim Hauzi ,  Eran Tamari ,  Per H. Hammarlund ,  Jonathan M. Redshaw ,  Alfredo Kostianovsky ,  Idan Nissel ,  Leonid Gitelman ,  Oren Betzalel ,  Dalia R. Haim ,  Lior Zimet

IPC: G06F30/398 ,  G06F30/392 ,  G03F1/70

Abstract: A chip design methodology and a set of integrated circuits that are taped out from a common design database are disclosed. The area of a full instance of the integrated circuit is defined, and one or more chop lines are defined to identify portions that will be removed for one or more partial instances. A variety of techniques and mechanisms are defined to permit the tape outs to occur from a common design database, so that the effort to tape out partial instances may be minimized beyond that to tape out the full instance.