Invention Application
- Patent Title: MULTI-CHAMBER PROCESSING TOOL WITH ENHANCED THROUGHPUT
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Application No.: US18202335Application Date: 2023-05-26
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Publication No.: US20240395514A1Publication Date: 2024-11-28
- Inventor: Prashant AGARWAL , Junqi WEI , Ananthkrishna JUPUDI , Clinton GOH , Tuck Foong KOH , Kai Liang LIEW
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/02 ; C23C14/34 ; C23C14/54 ; C23C14/56 ; C23C14/58 ; H01L21/324 ; H01L21/67 ; H05B6/80

Abstract:
Embodiments of multi-chamber processing tools are provided herein. In some embodiments, a multi-chamber processing tool includes: a factory interface configured to receive a substrate; a pre-heat chamber directly coupled to the factory interface; a load lock chamber coupled to the factory interface and having a first slit valve disposed therebetween, wherein the load lock chamber is coupled to a pump configured to create a vacuum environment when the first slit valve is in a closed position; a degas chamber coupled to the factory interface and having a second slit valve, wherein the degas chamber is coupled to a second pump configured to create a vacuum environment when the second slit valve is in a closed position, and wherein the degas chamber includes a heat source; one or more process chambers; and a transfer chamber coupled to the load lock chamber, the degas chamber, and the one or more process chambers.
Information query