公开(公告)号：US20210249239A1

公开(公告)日：2021-08-12

申请号：US17167469

申请日：2021-02-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Naman APURVA ,  Lara A. HAWRYLCHAK ,  Mahesh RAMAKRISHNA ,  Sriharish SRINIVASAN ,  Prashant AGARWAL

IPC: H01J37/32 ,  H01L21/67

Abstract: Embodiments of exhaust liner systems are provided herein. In some embodiments, an exhaust liner system for use in a process chamber includes a lower exhaust liner having an annular body with a central opening; an upper flange, a central flange, and a lower flange extending outward from the annular body, wherein the lower flange and the central flange partially define a first plenum, and wherein the central flange and the upper flange partially define a second plenum; a plurality of exhaust holes from the central opening to the first plenum; and at least one cutout in the central flange to provide a flow path from the first plenum to the second plenum, wherein the lower exhaust liner defines a gas flow path from the central opening to the first plenum via the plurality of exhaust holes and from the first plenum to the second plenum via the least one cutout.

公开(公告)号：US20210172806A1

公开(公告)日：2021-06-10

申请号：US17073733

申请日：2020-10-19

Applicant: APPLIED MATERIALS, INC.

Inventor： Ananthkrishna JUPUDI ,  Sai Kumar KODUMURI ,  Vinodh RAMACHANDRAN ,  Prashant AGARWAL ,  Hadi Bin Amir MUHAMMAD

IPC: G01K1/16 ,  G01K1/14 ,  G01K13/00

Abstract: An apparatus for determining temperatures of substrates in microwave and/or vacuum environments. A substrate holder with a plurality of support pins includes a temperature sensor assembly with at least a portion of a surface with a phosphorous coating is configured to be inserted in at least one pin support position from an inner area of the substrate holder and in at least one pin support position from an outer area of the substrate holder. The temperature sensor assembly includes a temperature sensor pin with a spring that is microwave transparent. The temperature sensor pin is made of a material with a thermal conductivity greater than approximately 200 W/mK and a low thermal mass which is microwave transparent. An optical transmission assembly is embedded into at least a portion of the substrate holder to receive light emissions from a surface of the temperature sensor pin.

公开(公告)号：US20230343615A1

公开(公告)日：2023-10-26

申请号：US17726808

申请日：2022-04-22

Applicant: Applied Materials, Inc.

Inventor： Prashant AGARWAL ,  Tuck Foong KOH ,  Ananthkrishna JUPUDI

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/687

CPC classification number: H01L21/67248 ,  H01L21/6732 ,  H01L21/68742

Abstract: A system for degassing substrates provides reduced infrared sources in a degas chamber. In some embodiments, the system includes a degas chamber with a microwave source and an infrared temperature sensor positioned in a bottom of the degas chamber, at least one hoop with an annular shape that is configured to support or lift a substrate and is formed from at least one first material that is opaque to microwaves and has an emissivity of 0.1 or less, and at least one actuator with a movable vertical shaft. Each of the at least one actuator is attached under one of the hoops at an outer perimeter of the hoop. The portion of the movable vertical shaft that is exposed to microwaves from the microwave source in the degas chamber is formed from at least one second material that is opaque to microwaves and has an emissivity of 0.1 or less.

公开(公告)号：US20220406643A1

公开(公告)日：2022-12-22

申请号：US17351530

申请日：2021-06-18

Applicant: Applied Materials, Inc.

Inventor： Tuck Foong KOH ,  Prashant AGARWAL ,  Ananthkrishna JUPUDI

IPC: H01L21/687 ,  H01L21/67 ,  H05B6/64

Abstract: Embodiments of substrate supports for use in microwave degas chambers are provided herein. In some embodiments, a substrate support for use in a microwave degas chamber includes a support plate having one or more support features for supporting a substrate; a susceptor comprising a plate disposed on the support plate, wherein the susceptor includes one or more openings, wherein the one or more support features extend through corresponding ones of the one or more openings; and a metal foil disposed beneath a side of the susceptor facing the support plate.

公开(公告)号：US20220140456A1

公开(公告)日：2022-05-05

申请号：US17084804

申请日：2020-10-30

Applicant: Applied Materials, Inc.

Inventor： Rajesh Kumar PUTTI ,  Prashant AGARWAL ,  Ananthkrishna JUPUDI

IPC: H01P1/08

Abstract: Apparatus for transmitting microwaves into a process chamber using a microwave pressure window assembly. The microwave pressure window assembly may include a first plate with a first aperture surrounded by a first recess for a first pressure seal, a second plate with a second aperture surrounded by a second recess for a second pressure seal, a dielectric plate configured to transmit microwaves and interposed between the first plate and the second plate and between the first pressure seal and the second pressure seal. The apertures include a first vertical step area on a first vertical side of the apertures and a second vertical step area on a second vertical side of the apertures opposite of the first vertical side. The first vertical step areas and the second vertical step areas may have a thickness of approximately 50% of a thickness of the plates that includes a dielectric plate recess.

公开(公告)号：US20240395514A1

公开(公告)日：2024-11-28

申请号：US18202335

申请日：2023-05-26

Applicant: Applied Materials, Inc.

Inventor： Prashant AGARWAL ,  Junqi WEI ,  Ananthkrishna JUPUDI ,  Clinton GOH ,  Tuck Foong KOH ,  Kai Liang LIEW

IPC: H01J37/32 ,  C23C14/02 ,  C23C14/34 ,  C23C14/54 ,  C23C14/56 ,  C23C14/58 ,  H01L21/324 ,  H01L21/67 ,  H05B6/80

Abstract: Embodiments of multi-chamber processing tools are provided herein. In some embodiments, a multi-chamber processing tool includes: a factory interface configured to receive a substrate; a pre-heat chamber directly coupled to the factory interface; a load lock chamber coupled to the factory interface and having a first slit valve disposed therebetween, wherein the load lock chamber is coupled to a pump configured to create a vacuum environment when the first slit valve is in a closed position; a degas chamber coupled to the factory interface and having a second slit valve, wherein the degas chamber is coupled to a second pump configured to create a vacuum environment when the second slit valve is in a closed position, and wherein the degas chamber includes a heat source; one or more process chambers; and a transfer chamber coupled to the load lock chamber, the degas chamber, and the one or more process chambers.

公开(公告)号：US20230086151A1

公开(公告)日：2023-03-23

申请号：US17483085

申请日：2021-09-23

Applicant: Applied Materials, Inc.

Inventor： Tuck Foong KOH ,  Ananthkrishna JUPUDI ,  Prashant AGARWAL

IPC: H01L21/67 ,  H01L21/66 ,  H01J37/32

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises performing a first vacuum processing procedure on a substrate, obtaining temperature measurements of the substrate from a vacuum thermocouple, obtaining temperature measurements of the substrate from a non-contact infrared sensor, calibrating the non-contact infrared sensor based on the temperature measurements from the vacuum thermocouple and the temperature measurements from the non-contact infrared sensor, and performing a second vacuum processing procedure on the substrate using the calibrated non-contact infrared sensor.