A semiconductor package includes: a first redistribution layer structure; a first semiconductor die disposed on the first redistribution layer structure; a second semiconductor die disposed adjacent to the first semiconductor die on the first redistribution layer structure; a molding material positioned on the first redistribution layer structure, and covering the first semiconductor die and the second semiconductor die; a bridge die positioned on the molding material, the first semiconductor die, and the second semiconductor die, and electrically connecting the first semiconductor die and the second semiconductor die to each other; a substrate positioned on the molding material, the first semiconductor die, and the second semiconductor die, and at least partially surrounding the bridge die; and a second redistribution layer structure disposed on the bridge die and the substrate.