Invention Application
- Patent Title: KINEMATICALLY ALIGNED OPTICAL CONNECTOR FOR SILICON PHOTONIC INTEGRATED CIRCUITS (PICs) AND METHOD FOR MAKING SAME
-
Application No.: US18325512Application Date: 2023-05-30
-
Publication No.: US20240402443A1Publication Date: 2024-12-05
- Inventor: John M. Heck , Saeed Fathololoumi , Harel Frish , Sang Yup Kim , Hari Mahalingam , Nicholas D. Psaila
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G02B6/42
- IPC: G02B6/42 ; H01L25/16

Abstract:
A kinematically aligned optical connector may be implemented with a silicon PIC component and a glass substrate component. The kinematically aligned optical connector includes one or more kinematic connectors or mechanical alignment features and visual fiducials that enable true kinematic coupling (i.e., in a three-dimensional Cartesian coordinate system, full constraint in all 6 degrees of freedom, meaning, X, Y, Z planes and all 3 angles), and enables an increased thickness of the glass substrate material of the glass waveguide substrate.
Information query